DURHAM, NC – Nextreme Thermal Solutions has raised $16.3 million toward a $23.3 million funding, according to a regulatory filing.

The company revealed the funding in a filing with the U.S. Securities and Exchange Commission.

Nextreme raised a $13 million B round led by New York-based Chart Venture Partners with Virginia’s Redshift Venture Partners, New York’s Harris & Harris Group, Virginia’s In-Q-Tel, and Japan’s Itochu Corp. in August 2008.

It has raised more than $43 million in three rounds of venture backing so far. Nextreme was a presenting company at TechJournal Souths’ first Southeast Venture Conference in 2007 (www.seventure.org).

The company, founded in 2004, develops cooling products that help keep tiny electronics from overheating, an increasing problem in the industry.

The military and telecom would use the devices to cool laser diodes, sensors and other equipment.

In a 2008 interview, Jesko von Windheim, CEO, told TechJournal South the ultimate aim is to sell the devices for cooling the microprocessors used in laptops, PCs, and mobile devices.

“We’ve already demonstrated that we can cool hot spots in microprocessors,” he says, “and there is a significant performance advantage when you do that,” he said.

Previously on TechJournal South:
Nextreme chills with $13M raise

http://techjournalsouth.com/news/article.html?item_id=5856

Online: www.nextreme.com

Southeast Venture Conference, February 29 – March 1, 2012 at the Ritz Carlton in Tysons Corner, VA – Where Smart Money Meets Smart People.
www.seventure.org

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